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The usage and features of stencil in SMT process Written by HC AUTOMATOIN / Read 82 times
   The stencil is mainly used for: accurate leakage and sinking of SMT solder paste or red glue on PCB patch pads. The method is to precisely corrode or laser cut the position and shape of the patch components on the PCB on the substrate, and use the outer frame to encapsulate it into a stencil with a certain tension.

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There are two basic processes for stencil production: for those with less stringent requirements and the component pin spacing ≥ 0.5mm, etching stencils are generally used, while those ≤0.5mm are used for precision laser stencils.

Features of Stencil in SMT process

1. The steel sheet is made of 304# stainless steel, the hardness is about 400, the carbon content is less than 8%, and the thickness is between 0.1mm~0.5mm, which can be reasonably selected according to customer requirements;

 

2. Use solvent-resistant AB glue for sealing the net, high-tensile Tedolon mesh, the tension is stable above 40 Newtons, not easy to fall off, and durable for long-term printing;

 

3. The opening position is accurate, and the hole wall is free of burrs, and different opening shapes can be designed according to different requirements of the product;

 

4. The regular size of the outer frame is 30*40cm/37*47cm/42*52cm/52*52cm/29*29 inches, etc.; special specifications can be customized on demand. The profiles are high-strength aluminum alloys, and the tensile properties are similar to those of cast iron solid frames, which can be used for a long time without deformation.